Printed electronics is becoming more and more common in IoT device design. Combining HMI, sensors, and conductive paths in one printed layer is not science fiction – it’s a real solution that lets you build thinner, lighter, and more reliable products. But still, many engineers have doubts. Below, we go through the most common objections we hear – and how to answer them.
Objection #1: “I have no experience with printed electronics”
hat’s perfectly fine. Today, it’s not about knowing everything – it’s about having a trusted technology partner who guides you step by step. That’s why we work with engineers using printed electronics for the first time. You don’t need to be an expert in conductive inks or S2S structures.
From the beginning, we provide:
- Ready-made samples of functional layers with HMI and sensors
- DXF/CAD libraries with editable design layers
- Complete connection diagrams, suggested mounting points, and routing paths
- A test checklist – how to check resistance, what to measure, how to plan for bending cycles
- Fast prototyping, and even video instructions for your team
You’re not just a number to us. We support first-time designers and those doing their hundredth project. Why? Because we believe technology only matters if it helps – if it simplifies, organizes, and brings real results.
That’s what happened with one of our clients – Michał. A few months ago, he asked us, “How do I make a touch panel like that?” Today, he orders batches of 10,000 integrated foil interfaces. He just started – and we started with him.
Objection #2: “I’m not sure it’s durable or repeatable”
This is a smart and valid concern. Anyone who’s built a product for end users knows lab tests are one thing – real-world use is another. That’s why every printed electronics component from LC Elektronik is designed and tested like industrial-grade components.
We don’t say “it should work.” We say “it passed the test.” Here are a few examples:
- Bending tests: minimum 10,000 cycles at 5 mm radius (standard for wearables)
- Electrical stability: every batch is measured (e.g. silver paths ≤ 0.02 Ω/□ at 10 µm thickness)
- Adhesion tests: checking how layers hold on PET, TPU, PC
- Chemical tests: resistance to detergents, sweat, alcohol, UV
- Thermal tests: from -30 to +80°C, in cycles up to 1000 hours
We use only industry-grade materials from trusted suppliers – Henkel, Elantas, Agfa – who know automotive, medtech, and home appliances standards. This isn’t a university experiment. These are components already working in washing machines, smartbands, and airplane seat buttons.
We test each stage – from first test plotter to final S2S sheet – checking aging, temperature changes, and long-term stability. If something’s going to fail – we want to know before your customer does.
Objection #3: “How do I connect it to the rest of the product?”
A very practical question – and one we hear often from mechanical engineers, technologists, and CAD designers. Good – because it’s not magic, it’s mechanics. Technology has to fit into a real case, not just look nice on a screen.
Every PE component we design is made to fit into a real product. You can ask us to design it as:
- A layer with adhesive backing (e.g. 3M 467MP), ready to stick, with cut edges
- A plate to slide into a case slot, with positioning holes
- A panel with a sealing edge, pressed in place when closing the case
- A version with ZIF tape or pads for FPC connectors
Some of our clients use our PE layers with injection-molded or 3D-printed cases. We prepare 3D insert models in STEP/IGS format to test fitting. If your team doesn’t have a model yet – we can send you a sample insert to test it manually.
We also support R&D teams that want to avoid extra clips and screws – we design components to fit together like building blocks. Simple. Secure. No extra parts.
Printed functional layers can be made for easy mounting. Integration options include:
- Adhesive layers on standard bonding fields (e.g. 3M 467MP)
- Sliding panels into housing with position holes
- Panels with flexible seals, pressed in place
- Optional: ZIF connectors, soldering pads, or snap-fit panels
We can match the component format to your 3D housing model. If needed, we’ll provide a test insert too.
Objection #4: “I don’t know if it makes sense for small volumes”
This is a common question from R&D teams testing a product. “We have an idea, maybe a pilot, but we don’t know if it will scale.” We get it – and that’s why we don’t ask you to invest in molds or big volumes for the first try.
With sheet-to-sheet (S2S) technology, we can make:
- Small series of 20–30 fully working units
- Test and demo versions for MVP, customer demos, or market research
- Variants with temporary masking and digital cutting – no plastic mold needed
- Prices based on project stage – not just mass production
- Later upgrades to roll-to-roll (R2R) printing or hybrid structures
Example:
A medtech startup came to us with a skin hydration monitoring patch. They didn’t have a microcontroller yet, or an investor. But they needed to show the solution worked. We made 25 sensors using S2S tech – touch interface, integrated paths, and graphics. They used them in customer meetings. That was enough to win market interest.
You don’t need to order 5,000 units just to test an idea. One prototype, one day of testing – and we’ll make sure it works: from the graphics to the resistance level.
Summary
Do you have doubts? Good. That means you’re a responsible designer. But don’t let doubts stop you from using technology that can simplify your design, shorten assembly, and remove possible failure points.
Printed electronics is ready for your project. And we’re ready to help.